News Release

• 09/01/2022: We won the Best Student Paper Award from the ACM/IEEE Workshop on Machine Learning for CAD (ML CAD)!
• 07/23/2022: We won the Best Paper Award from the ACM/IEEE International Symposium on Low Power Electronics and Design (ISLPED)! News Release
• 05/26/2022: We won the 2022 Donald O. Pederson Best Paper Award from the IEEE Transactions on Computer-Aided Design (T-CAD)!
• 05/07/2022: We won the 2022 Richard B. Shultz Best Paper Award from the IEEE Transactions on Electromagnetic Compatibility (T-EMC)!
• 03/10/2022: New Funding: from TSMC to investigate fine-grained architectures for 3D ICs.

• 11/01/2021: New Funding: from Samsung to investigate power delivery network design for 3D ICs.
• 08/25/2021: New Funding: from DOE to investigate 3D ICs for neuromorphic processors.
• 07/01/2021: Anthony's ISLPED 2021 paper is nominated for the Best Paper Award.
• 05/01/2021: New Funding: from PRC to compare glass vs. silicon interposer technologies at full-chip scale.
• 04/01/2021: New Funding: from Synopsys to investigate machine learning algorithms to predict timing closure capabilities of commercial P&R tools.
• 02/24/2021: Yi-chen and Pruek's ISPD 2021 papers are nominated for the Best Paper Award.
• 02/24/2021: Prof. Yoon joined GTCAD as a research associate.

• 10/22/2020: We won the Best Paper Award at the IEEE ICCD 2020.
• 10/11/2020: We won the Best Paper Award at the VLSI-SoC 2020.
• 06/02/2020: Yi-chen's DAC 2020 paper is nominated for the Best Paper Award.
• 05/20/2020: New Funding: from IMEC to develop 3D memory exploration framework.

• 10/25/2019: New Funding: from SRC to develop CAD tools for monolithic 3D ICs targeting logic applications.
• 08/01/2019: Yi-chen and Anthony's ICCAD 2019 papers are nominated for the Best Paper Award.
• 03/05/2019: New Funding: from Samsung to develop 3D IC placement algorithms.
• 03/05/2019: We are organizing a special session entitled "Monolithic 3D IC: Benefits, Architectures, and EDA Tools" at DAC 2019.
• 03/05/2019: We are giving a tutorial entitiled "State-of-the-Art in RTL-to-GDS Tools for Monolithic 3D ICs" at DAC 2019.

• 11/12/2018: New Funding: from NSF to investigate machine learning algorithms to predict PPA from netlists without performing physical design.
• 05/01/2018: Prof. Lim has won a Qualcomm Faculty Award 2018.
• 03/07/2018: New Funding: from NASA to investigate flash memory cube for space applications (SBIR phase 2).
• 02/24/2018: New Funding: from DARPA ERI program to investigate EDA tools for 3D IC technology.

• 12/16/2017: We won the Best Paper Award at the IEEE EDAPS 2017.
• 11/17/2017: Our ISPD'18 paper is nominated for the Best Paper Award.
• 10/14/2017: New Funding: from NSF IUCRC to investigate machine learning methods to predict FPGA compilation success.
• 10/05/2017: Our DARPA CHIPS project is featured on the Research Horizon, the institute-wide research website of Georgia Tech.
• 07/12/2017: New Funding: from NSF to investigate device/circuit co-optimization for negative capacitance transistors.
• 07/11/2017: New Funding: from SRC (under custom funding by ARM and Mentor) to investigate tier partitioning and extraction for wafer-bonded 3D ICs.
• 04/25/2017: Prof. Lim received the Qualcomm Faculty Award.
• 04/20/2017: New Funding: from NASA to investigate 3D flash cubes for space applications (SBIR phase 1).
• 04/03/2017: New Funding: from DARPA CHIPS program to investigate heterogeneous IP integration using 2.5D/3D IC technology.
• 03/08/2017: New Funding: from NASA to investigate 3D DRAM cubes for space applications (SBIR phase 2).
• 03/08/2017: New Funding: from TSMC to explore intrinsic monolithic 3D IC design limits and PPA analysis.
• 02/23/2017: Sandeep defended his thesis. He will join Intel.
• 01/31/2017: Prof. Lim received the Class of 1940 Course Survey Teaching Effectiveness Award.

• 09/25/2016: Our work with GlobalFoundries on monolithic 3D IC is accepted at IEDM 2016.
• 08/28/2016: New Funding: from Oak Ridge National Lab to investigate 3D IC impact on neuromorphic computing.
• 06/19/2016: New Funding: from ARM to investigate power delivery network design for monolithic 3D ICs.
• 06/09/2016: Our DAC 2016 paper is featured in Tech Design Forum.
• 06/08/2016: We have 3 papers accepted at ICCAD 2016, all on monolithic 3D IC. Our collaborators include ARM, GlobalFoundries, and IMEC.
• 06/06/2016: We organized a 3-hour Monday tutorial on TSV-based 3D ICs and monolithic 3D ICs at DAC 2016.
• 05/17/2016: Yarui will join Univ of Arkansas CSCE in spring 2017 as a tenure-track assistant professor. He becomes the 4th prof. GTCAD has produced.
• 05/06/2016: New Funding: from NASA to investigate 3D memory cubes for space applications.
• 04/25/16: We have 3 papers accepted at ISLPED 2016, all on monolithic 3D IC. Our collaborators include ARM, GlobalFoundries, and IMEC.
• 03/23/2016: Prof. Lim is invited as the main speaker for the ULTRA program organized by the Korean Ministry of Science, ICT and Future Planning (MSIP) and the Korean Federation of Science and Technology Societies (KOFST).
• 02/18/2016: We are organizing a 3-hour Monday tutorial on TSV-based 3D ICs and monolithic 3D ICs at DAC 2016.
• 02/01/2016: We made the finalist on the Qualcomm Innovation Fellowship (QInF) 2016.

• 12/02/15: New Funding: from Mentor to investigate parasitic extraction for 3D ICs.
• 10/22/15: Taigon defended his thesis. He will join Synopsys.
• 07/17/15: Prof. Lim is on an SRC article.
• 05/27/15: Prof. Lim gave the keynote speech at the Space Computing Workshop.
• 04/17/15: We won the Best Paper Award at the IEEE International Interconnect Technology Conference (IITC), 2014.
• 03/14/15: Shreepad defended his thesis. He will join Intel.
• 01/26/15: Prof. Lim's view on Stanford's monolithic 3D IC is featured in IEEE Spectrum.
• 01/01/15: Prof. Lim is serving on the IEEE D&T Editorial Board as an Associate Editor.

• 11/05/14: Prof. Lim gave a keynote talk at ISOCC 2014.
• 09/07/14: Yarui won the Best-in-Session award at TECHCON 2014.
• 08/05/14: Prof. Lim became the Dan Fielder Professor of School of ECE at Georgia Tech.
• 07/16/14: Dae Hyun is joining the EECS department at Washington State University as a tenure-track Assistant Professor in Fall 2014.
• 06/18/14: Our monolithic 3D IC research is featured in EE times.
• 05/22/14: New Funding: from Mentor to investigate parasitic extraction for 3D ICs.
• 03/21/14: Shreepad's ISPD 2014 paper is nominated for the Best Paper Award.
• 03/04/14: Prof. Lim will spend the summer at Qualcomm as a visiting faculty.
• 02/28/14: Moongon defended his thesis. He will join Intel Microprocessor Research Lab (MRL) in Santa Clara.
• 02/26/14: Prof. Lim's view on monolithic 3D IC is featured in IEEE Spectrum.
• 02/17/14: Moongon's TCAD 2012 paper is nominated for the Best Paper Award.
• 02/08/14: Shreepad's DAC 2014 paper is nominated for the Best Paper Award.
• 01/01/14: Our research on TSV stress analysis is featured as the Research Highlight in the Communications of the ACM.

• 12/16/13: We made it to the finalist for the Qualcomm Innovation Fellowship 2014.
• 11/15/13: Prof. Lim's book on 3D IC was the #1 seller at the ACM Design Automation Conference, 2013, in Austin.
• 10/29/13: Prof. Lim is serving on the IEEE TCAD Editorial Board as an Associate Editor.
• 09/19/13: Shreepad received the Padovani Scholarship Award from Qualcomm, two years in a row.
• 05/15/13: Prof. Lim will give an invited talk at the Advanced Metallization Conference (AMC 2013).
• 03/31/13: We won the Best Paper Award at the IEEE Asian Test Symposium (ATS), 2012.
• 03/20/13: Prof. Lim is promoted to a Full Professor.
• 03/14/13: Young-Joon defended his thesis. He will join Intel Microprocessor Research Lab (MRL) in Santa Clara.
• 01/20/13: Prof. Lim is giving a keynote speech at the DATE workshop on 3D Integration.

• 11/07/12: New Funding: from Samsung to investigate power distribution network design for 3D DRAM.
• 11/07/12: Shreepad received the Padovani Scholarship Award from Qualcomm.
• 10/12/12: Xin defended her thesis.
• 08/04/12: New Funding: from Qualcomm to investigate thermal reliability issues in monolithic 3D ICs.
• 07/31/12: Xin's ISLPED 2012 paper is nominated for the Best Paper Award.
• 07/25/12: Krit defended his thesis.
• 07/25/12: New Funding: from the Korean Government to investigate 3D IC designs for smart sensor network through CISS.
• 05/17/12: New Funding: from Samsung to investigate design-for-reliability for 3D DRAM.
• 04/14/12: Moongon will intern at Intel during summer.
• 03/09/12: Prof. Lim organized the second e-workshop for the SRC FCRP Cross-cut Theme on 3D Integration, which is attended by 250+ registrants (closed to FCRP members).
• 03/06/12: Dae Hyun defended his thesis.
• 03/05/12: New Funding: from Intel/SRC to investigate low power, multi-core 3D processor designs.
• 02/29/12: Xin's TCAD 2011 paper is nominated for the Best Paper Award.
• 02/21/11: Our 3D-MAPS V1 paper is presented at the ISSCC 2012.
• 02/20/12: Moongon's DAC 2012 paper is nominated for the Best Paper Award (nomination back-to-back in 2011 and 2012)
• 02/10/12: We have 3 papers accepted at DAC 2012, all on 3D IC design and CAD.
• 01/16/12: Shreepad will intern at Qualcomm during summer.

• 10/14/11: New Funding: from SRC/CADTS to investigate design-for-reliability issue for 3D IC.
• 09/15/11: Chang's TECHCON 2011 paper got the Best Paper in Session Award.
• 08/30/11: New Funding: from SEMATECH to investigate reliability issues in 3D IC.
• 08/16/11: New Funding: from US DOD to build and test 3D-MAPS V2.
• 05/13/11: New Funding: from Intel/SRC to investigate monolithic 3D integration.
• 05/01/11: Mohit will join Cadence.
• 04/12/11: Our works [DAC'10, ICCAD'10] are featured in SRC 2010 annual report (page 12) as one of two highlights in the FCRP IFC section.
• 04/01/11: Young-joon will do summer internship at Cadence.
• 04/01/11: Xin will do summer internship at IBM Watson.
• 03/07/11: Moongon's DAC 2011 paper is nominated for the Best Paper Award.
• 02/15/11: Prof. Lim is organizing a special session on 3D IC at DAC 2011, entitled "Killer Apps for 3D ICs?"
• 02/11/11: Prof. Lim organized the first e-workshop for the SRC FCRP Cross-cut Theme on 3D Integration, which is attended by 350+ registrants (open to public).

• 09/07/10: GT-KAIST dual degree program, coordinated by Prof. Lim, is announced to the GT community.
• 08/27/10: Mike defended his thesis. He will join IBM TJ Watson Research Center.
• 08/01/10: Mike won the Intel/CICC Student Scholarship Award for his CICC 2010 paper.
• 07/01/10: New Funding: from NSF to investigate DFM issues for TSV-based 3D IC.
• 06/28/10: We have 3 papers accepted at ICCAD 2010, all on 3D IC physical design.
• 05/18/10: New Funding:from SRC GRC/ICSS to investigate heterogeneous 3D integration issues.
• 05/01/10: New Funding: from Intel to investigate heterogeneous 3D integration issues.
• 03/15/10: We have taped out the world's first 3D many-core processor from academia.
• 03/03/10: Rohan receives the 2010 "Outstanding Undergraduate Researcher Award" in GT-COE.

• 12/28/09: Prof. Lim contributed to ITRS 2009 with the roadmap for 3D EDA.
• 11/14/09: New Funding: from Intel to investigate DFM issues for TSV.
• 09/11/09: Xin's ICCAD'09 paper is nominated for the best paper award.
• 07/31/09: Faik defended his thesis. He will join Bogazici University in Turkey as a tenure-track faculty in fall 2009.
• 07/26/09: We have 3 papers accepted at ICCAD 2009, all on 3D IC physical design.
• 07/01/09: Prof. Lim will lead the cross-center theme on 3D research among 6 of SRC's focus centers: IFC, C2S2, GSRC, MSD, FENA, and MuSyC.
• 06/10/09: New Funding: from NSF to investigate 3D integration of sub-threshold many-core and super-threshold multi-core processors for ultra-low power co-processing.
• 05/01/09: New Funding: from the Korean Government to investigate 3D integration of CPU and GPU many-core processors.
• 03/30/09: Mongkol defended his thesis. He will join the Asian Institute of Technology (AIT) in Thailand as a tenure-track faculty.
• 03/11/09: New Funding: from SRC Interconnect Focus Center (IFC) to study ultra fine-grained 3D integration.

• 12/02/08: New Funding: from the US DOD to design, fabricate, and test a 3D multi-core processor with stacked memory.
• 07/30/08: Prof. Lim's new book titled "Practical Problems in VLSI Physical Design Automation" goes on sale.
• 03/24/08: Prof. Lim received the SIGDA Distinguished Service Award.
• 02/12/08: New Funding: from SRC Interconnect Focus Center to study many-tier 3D systems.

• 11/28/07: Prof. Lim received a 2008 Hesburgh Teaching Fellow Award, an institute-level teaching award.
• 08/15/07: New Funding: from SRC Interconnect Focus Center to study chip/package co-design for 3D stacked ICs.
• 06/01/07: New Funding: from the GT Packaging Research Center to study embedded passive CAD tools.
• 05/08/07: Prof. Lim taught at Korea University and KAIST during summer 2007.
• 03/20/07: Prof. Lim received the 2007 School of ECE Outstanding Junior Faculty Member Award.
• 02/20/07: Prof. Lim got promoted to an Associate Professor with tenure.
• 01/28/07: Prof. Lim is appointed as an Associated Editor of the IEEE Transactions on Very Large Scale Integration Systems (TVLSI).

• 07/20/06: Jacob defended his thesis. He will work at Synopsys.
• 05/09/06: New Funding: from MARCO/C2S2 project on 3D physical design.
• 04/11/06: Our ISPD'06 paper is nominated for best paper award.
• 01/01/06: Prof. Lim receives an NSF CAREER award.

• 11/14/05: Mongkol defended his thesis.
• 09/07/05: New Funding: from Intel on equipment grant.
• 05/05/05: New Funding: from MARCO/C2S2 to support microarchitectural CAD research.

• 07/28/04: New Funding: from NSF on FPAA mapping.
• 05/13/04: New Funding: from NSF on QCA placement.

• 08/16/03: New Funding: from DAPA on PCA placement.
• 04/07/03: We received the 40th DAC Scholarship for our 3D package research.

• 08/15/02: New Funding: from NSF on 3D package routing.

• 08/15/01: GTCAD Lab opened.